Thermax® PI/PAI is a high-heat resistant enamel rectangular wire. Thermax® PI/PAI has a high space factor contributing to higher motor efficiency which makes it a preferred choice in high voltage driving motors for xEV.
It is composed of rectangular copper with an enameled layer. In addition to the current lineup of a maximum of 60μm we are currently developing the enamel layer to provide a film thickness of approximately 100μm in view of high voltage.
By selecting PAI or PI resin with high-heat resistance, the enamel layer is highly reliable with a Thermal Index 220°C (PAI) or 240°C (PI)