Thermax® PI/PAI – Rectangular

Product Results // Thermax® PI/PAI – Rectangular

Thermax® PI/PAI is a high heat resistant enamel rectangular wire and highly reliable. This has a high space factor contributing to higher motor efficiency. Thermax® PI/PAI is used in high voltage driving motors for xEV. It is composed of rectangular copper with an enameled layer. In addition to the current lineup of a maximum of 60μm we are currently developing the enamel layer to provide a film thickness of approximately 100μm in view of high voltage.

Features:

  • Rectangular shape enables a high space factor and contributes to higher motor efficiency.
  • By selecting PAI or PI resin with high heat resistance, the enamel layer is highly reliable with a Thermal Index 220°C (PAI), 240°C (PI)

Build:

  • Type 0
  • Type 1

Temp 220°C (PAI) 240°C (PI)
Material
  • Copper
  • Insulation Polyamide-imide, Polyimide
    Shapes
    • Rectangular
    Sizes
    Standards

    NEMA: MW-84C, MW-20C
    IEC: 60317-47
    JIS: C3215

    Locations
    • Japan
    Markets
    • Automotive
    Temp 220°C (PAI) 240°C (PI)
    Material
    • Copper
    Insulation Polyamide-imide, Polyimide
    Shapes
    • Rectangular
    Sizes
    Standards

    NEMA: MW-84C, MW-20C
    IEC: 60317-47
    JIS: C3215

    Locations
    • Japan
    Markets
    • Automotive

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