SFBLOCKY5A

Product Results // SFBLOCKY5A

Enameled round copper wire. Melt temp higher type. Only Toshiba Special grade.

Thermal Class F

Dual Structure

Temp Array
Material
  • Copper
  • Insulation Solderable Modified Polyester
    Shapes
    • Round
    Sizes

    0.60, 0.65

    Standards

    IEC: 60317-35

    Locations
    • Malaysia
    Markets
    • Commercial & Residential
    Temp
  • 155°C
  • Material
    • Copper
    Insulation Solderable Modified Polyester
    Shapes
    • Round
    Sizes

    0.60, 0.65

    Standards

    IEC: 60317-35

    Locations
    • Malaysia
    Markets
    • Commercial & Residential

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