CEW5AI

Product Results // CEW5AI

Enameled round copper wire.

Thermal Class H

Dual Structure

Temp 220°C
Material
  • Copper
  • Insulation Self-bonding Polyamideimide
    Shapes
    • Round
    Sizes

    0.90-1.30

    Standards

    IEC: 60317-28
    GB/T: 6109.19

    Locations
    • Malaysia
    Markets
    • Automotive
    Temp 220°C
    Material
    • Copper
    Insulation Self-bonding Polyamideimide
    Shapes
    • Round
    Sizes

    0.90-1.30

    Standards

    IEC: 60317-28
    GB/T: 6109.19

    Locations
    • Malaysia
    Markets
    • Automotive

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