CEW5AI

Product Results // CEW5AI

Enameled round copper wire.

Thermal Class H

Dual Structure

Temp 200°C
Material
  • Copper
  • Insulation Self-bonding Polyamideimide
    Shapes
    • Round
    Sizes

    0.90-1.30

    Standards
    Locations
    • Malaysia
    Markets
    • Commercial & Residential
    • Energy
    Temp 200°C
    Material
    • Copper
    Insulation Self-bonding Polyamideimide
    Shapes
    • Round
    Sizes

    0.90-1.30

    Standards
    Locations
    • Malaysia
    Markets
    • Commercial & Residential
    • Energy

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