CEW30AI Selfbond

Product Results // CEW30AI Selfbond

Heat resistant self bonding by thermal 180°C. Thermal resistance over 200°C.

Build:

  • Type 0
  • Type 1

Temp 200°C
Material
  • Copper
  • Insulation Self bonding by thermal 180C, Thermal Resistance over 200C
    Shapes
    • Round
    Sizes

    0.45~1.6 mm

    Standards

    NEMA: MW102C
    IEC: 60317-28

    Locations
    • Japan
    Markets
    • Automotive
    • Commercial & Residential
    • Energy
    Temp 200°C
    Material
    • Copper
    Insulation Self bonding by thermal 180C, Thermal Resistance over 200C
    Shapes
    • Round
    Sizes

    0.45~1.6 mm

    Standards

    NEMA: MW102C
    IEC: 60317-28

    Locations
    • Japan
    Markets
    • Automotive
    • Commercial & Residential
    • Energy

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